Cushioning material for 8-inch frame shipping cases (between semiconductor processes)
We have developed cushioning materials for safely transporting frame shipping cases for 8-inch dicing frames between semiconductor processes.
Introduction of the "Cushioning Material for 8-Inch Frame Shipping Cases." We have developed cushioning material to safely transport frame shippers for 8-inch dicing frames between semiconductor processes. It is designed using PAOSS (Cushioning Simulation) technology. Actual drop tests have also been confirmed to meet JIS Z0200 Level I! It is assembled and delivered in a folded state, allowing it to fit into a small space when folded. It is compatible with models such as "FR-B200-P/FR-B200-E." Packing size: 5 sets/packaging (poly bag) Approximately 464mm x 340mm x 620mm h Please feel free to contact us when you need assistance. 【Specifications (Excerpt)】 ■ Material: Expanded polyethylene (Suntec foam) ■ Actual drop test: Confirmed to meet JIS Z0200 Level I ■ Compatible models: E400-276-101-0615, FR-B200-P/FR-B200-E ■ Packaging specifications: 5 sets/PE bag ■ Packaging size: Approximately 465 x 340 x 620H *For more details, please refer to the PDF document or feel free to contact us.
- Company：旭洋 東京本店・化成品・機能材営業本部
- Price：Other
